Advanced Packaging: Thermal Compression Bonding Engineer

Intel Corporation in Malaysia, Kulim is seeking a Thermal Compression Bonding Development Engineer to drive innovations in semiconductor packaging. You will enhance processes crucial to our advanced packaging technologies, collaborating across teams to ensure quality and reliability.

The ideal candidate will have a Master's degree in a relevant STEM field, familiarity with semiconductor processes, and experience in data analysis tools. This position emphasizes hands-on involvement and direct contributions to our packaging advancements.