Location
singapore
Job Type
Full-time
Posted
June 19, 2026
Job Description
Job Description
- You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals. You will work closely with package design & technology, test & product engineering, production planning, quality engineering & NPI teams, assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, managing process improvements and changes. Provide day‑to‑day support to bump and assembly suppliers & internal planning, product and test engineering teams. Plan, drive & implement improvement activities for continual improvement, 2nd sourcing, cost reduction & customer satisfaction.
Qualifications
- PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7–12 years of relevant experience of managing advanced node silicon bumping, large body single & multi‑chip (2.1/2.5/3D...