Design & Simulation Engineer – AI-Driven Packaging

Tampereen yliopisto is seeking a Design, Simulation and Modelling Engineer for SiPFAB. This role involves leading the development of design processes in semiconductor packaging.

Your responsibilities will include engaging with research and industry partners, optimizing design methodologies, and contributing to innovative AI-driven solutions. The position offers competitive benefits, a flexible work schedule, and a strong opportunity for impact within the field.