Die Attach & Flip Chip Process Engineer — Packaging Innovation

Analog Devices is seeking a skilled process engineer in Penang, Malaysia, to develop and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging. The ideal candidate will hold a Bachelor’s or Master’s degree in a related field with 3–10 years of hands-on experience. Responsibilities include providing engineering support, troubleshooting yield issues, and ensuring compliance with quality standards. This role also involves close collaboration with cross-functional teams and addressing failure analysis and reliability aspects.
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