Die Attach & Thermal Bonding Process Engineer On-Site Kulim

A leading semiconductor company in Kulim, Malaysia, is seeking a Process and Equipment Module Engineer to manage high-volume manufacturing equipment. The role involves conducting tests, implementing improvements, and ensuring safety and quality standards. Candidates need a Bachelor's degree in Engineering and at least 2 years of relevant experience in semiconductor assembly processes. This full-time position requires on-site presence and offers a competitive salary package.
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