Die Bond Process Engineer: NPI & Yield Improvement Lead

Renesas Electronics in Selangor, Malaysia is seeking an Assembly Process Engineer to support production operations. The role includes optimizing processes, leading New Product Introductions, and troubleshooting manufacturing issues. Candidates must have a Bachelor’s Degree in Engineering and at least 2 years of experience. Strong analytical and communication skills are essential. The position emphasizes continuous improvement, process documentation, and cross-functional collaboration.
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