ENGR SR, PACKAGE DEVELOPMENT_TL (NPI)

NPI Engineer – Soldering Process, Diebond and Wirebond

Onsemi is looking for a skilled and driven NPI Engineer to lead the introduction and optimization of soldering, diebond, and wirebond processes for new product lines in a high‑tech manufacturing environment. The role is essential in ensuring robust process integration, high‑yield production, and a seamless transition from development to manufacturing. This position reports to the Director, New Product Engineering.

Responsibilities

• Lead the development and implementation of soldering, diebond, and wirebond processes for new product introductions (NPI).
• Collaborate with R&D, Process Engineering, and Manufacturing teams to ensure soldering, diebond, and wirebond processes meet design and reliability requirements.
• Define process parameters, control plans, and qualification strategies for soldering, diebond, and wirebond operations.
• Conduct DFM reviews with a focus on...