Location
ipoh
Job Type
Full-time
Posted
July 08, 2026
Job Description
Primary Duties & Responsibilities
- Responsible for sustaining & improving the Die Attach & Wire Bond Process.
- Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for New products and regular production.
- Monitor and maintain Assembly yield within KPI target.
- Key involvement in improving the systems to bring down scrap rate due to process excursions.
- Initiate process improvements through effective evaluations of test/yield data and manufacturing defects and make adjustments to process equipment accordingly.
- Program, troubleshoot and maintain manufacturing process equipment as required to meet the required yield target.
- Support engineering initiatives in evaluating: solders, epoxies, new equipment (installations) and recommend solutions both tactically and strategically.
- Develop Manufacturing Work Instructions and product...