Hybrid Back-End Process Engineer: Die & Wire Bonding

A multinational semiconductor company in Malaysia is seeking a Process Engineer with over 2 years of experience in semiconductor back-end assembly processes, specifically in die bonding and wire bonding. The successful candidate will focus on optimizing manufacturing processes, troubleshooting, and collaborating across teams to ensure high-quality outcomes. The role offers a hybrid working model combining remote and in-office work for enhanced teamwork and innovation.
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