Lead / Principal IC Packaging Design Engineer

Lead / Principal IC Packaging Design Engineer Location, Work Mode & Experience <p data-end="6286" data-start="6225"><b>Location:</b> Chandler, Arizona OR Hillsboro, Oregon (Onsite)</p> <p data-end="6335" data-start="6288"><b>Employment:</b> Long-Term Contract (12+ Months)</p> <p data-end="6362" data-start="6337"><b>Experience:</b> 10+ Years</p> Role Overview <p data-end="6737" data-start="6387">We are seeking a Lead IC Packaging Design Engineer with extensive experience in advanced semiconductor package development. This role will lead package implementation, guide complex substrate designs, collaborate with architecture, SI/PI, manufacturing, and reliability teams, and drive high-quality package solutions from concept through production.</p> Key Responsibilities <ul data-end="7439" data-start="6769&quo...