Lead Staff Engineer, HBM Packaging & Yield Innovation

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a passionate individual to join the HIG HBM Package Product Engineering team. This role involves leading a high-performing team to drive engineering activities, enhancing product yield and quality through effective collaboration.

The ideal candidate will hold a Bachelor's or Master's degree in Electrical, Electronic, or Mechanical Engineering and possess strong problem-solving skills. This opportunity involves onsite work in Singapore with potential travel to Taiwan, the US, and Japan.