Mechanical and Thermal Analysis of Advanced Packaged Devices Intern

As an AMD intern/co‑op, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end‑users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.

LOCATION: Singapore

CRITERIA: Current students studying in universities based in Singapore

INTERNSHIP DURATION: The internship will begin on either 4 May 2026 or 20 July 2026, and will end on 4 Dec 2026. There is an option to extend the internship, with the extended period concluding on a fixed date of 18 Dec 2026.

• Hands‑on experience with mechanical and thermal analysis techniques applied to advan...