Module Equipment Engineer: Lead High-Volume IC Ops

Intel Corporation is hiring a TEG Module Equipment Engineer in Malaysia to lead equipment ownership and process optimization. This role involves mentoring, conducting tests, and analyzing data to improve production efficiency. A degree in engineering or a technical field is required, along with L3 certification and at least 2 years of factory experience. The successful candidate will work closely with cross-functional teams to drive operational excellence and enhance manufacturing capabilities.
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