Location
Carmona
Job Type
Full time
Posted
June 04, 2026
Job Description
To contribute in advancing high‑precision semiconductor production by applying technical skills in back‑end assembly test operation.
• Perform specific back-end semiconductor manufacturing functions in the production of semiconductor devices
• Operate various equipment in performing functions such as wafer scribe and break, die sort, die attach, lead bonding and seal, test, or mark and pack.