Research Fellow: Cu–Cu Hybrid Bonding for 3D ICs

Nanyang Technological University is looking for a Research Fellow to advance low-temperature Cu/dielectric hybrid bonding technologies for high-density interconnects. This role involves developing processes, conducting reliability tests, and coordinating with partners to prepare technical reports.

The ideal candidate will have a PhD in a relevant field and hands-on experience in semiconductor processing. Strong communication in English and proficiency in relevant characterization techniques are essential.