Resident Packaging Engineer – OSAT, Yield & RTM Lead

A leading semiconductor company in Malaysia is looking for a hands-on Resident Package Engineer to support mass production of multi-die wirebond leadframe packages. This role involves sustaining manufacturing performance and managing technical processes at the OSAT partner. Ideal candidates should have a B.S. in a relevant engineering field and at least 2 years of experience in semiconductor back-end assembly. Strong wirebond process knowledge and excellent troubleshooting skills are essential for success in this position.
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