Scientist (Multi Chiplet Heterogeneous Integration and High speed IO designer (SIP)), IME

Job Description

We are seeking a highly skilled multi-physics modelling and Process Design Kit (PDK) development engineer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (PhD), will focus on converting 2.5D/3D/3.5D chiplet based System in Package design and integration needs into advanced packaging PDK interconnect models, advanced co-simulation frameworks and reference flows. The successful candidate will play a crucial role in developing accelerating simulation, analysis and modelling towards design enablement of state‑of‑the‑art advanced packaging.

Key Responsibilities

• Collaborate with cross‑functional (Electrical, Thermal and Mechanical) package design and analysis teams to ensure solid understand of the analysis parameters, input / outputs and modelling requirements.
• Evaluate and develop accurate PDK components using classical methods, multi‑physics methods such as reduced o...