Senior Advanced Packaging Architect for HPC/AI Chips

A global technology company in Malaysia is seeking a Staff / Principal Advanced Packaging Engineer to lead advanced packaging architecture and technology strategy for next-generation HPC and AI silicon. This high-impact role involves defining the packaging roadmap and driving large-die, high-power device production. Candidates should have over 8 years in advanced semiconductor packaging and be proficient in SI/PI analysis, ensuring a successful transition from concept to high-volume manufacturing.
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