Senior Die Bond Process Development Engineer

Infineon Technologies AG in Malacca City is seeking a qualified individual for process development in die bonding technology. The role requires a Bachelor’s degree in Engineering and 5 years of relevant experience, specifically with glue epoxy die bonding at platforms like ASM and ESEC.

The ideal candidate demonstrates strong innovation and problem-solving skills and collaborates well in a team. Knowledge of statistical analysis software such as JMP and Minitab is advantageous. Infineon prides itself on embracing diversity and fostering an inclusive working environment.