Senior Package Technology Lead – OSAT Platform & Innovation

Infineon Technologies · , penang, malaysia, penang, Malaysia

Location
, penang, malaysia
Job Type
Full-time
Posted
June 14, 2026

Job Description

Responsibilities

  • Lead and participate in outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet time‑to‑market, product quality, process capability, and assembly yield targets.
  • Define package definition tasks in the OSAT segment, including project complexity definition with Delta assessment list, project category assessment, and project risk assessment with mitigation actions.
  • Integrate unit processes until process freeze for assembly and test at subcons, creating assembly specifications, marking instructions, and packing specifications for upload into the database.
  • Apply and verify design rules based on established baseline documents and specific equipment and process capability of assembly sites; support OSAT technical capability assessment.
  • Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements...

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