Senior Packaging Engineer, InFO & Chiplet

AMD is looking for a candidate in George Town, Penang, Malaysia, to manage assembly processes for InFO and Chiplet package readiness. The ideal candidate must have strong technical and program management skills, capable of leading projects and improving operational efficiencies in a fast-paced environment.

Responsibilities include ensuring manufacturing readiness, quality control, and strategic supplier management while actively communicating across various teams. A Bachelor's/MS degree in relevant engineering fields is required.