Senior Research Engineer - Wafer Bond (all genders)

Academic Positions · Stockholm, Stockholm County, Sweden

Location

Stockholm

Job Type

permanent

Posted

July 08, 2026

Job Description

Are you ready to drive cutting-edge wafer bonding technologies? Join our wafer-level packaging team and help pioneer innovative processes for bonding and debonding wafers, enabling the development of next-generation 3D and heterogeneous integration technologies.
Your future tasks include:
Development and optimization of wafer bonding processes for advanced packaging and heterogeneous integration
Operation and ownership of wafer bonding equipment (wafer bond cluster line as well as stand-alone wafer bonder)
Process development for permanent and temporary wafer bonding techniques such as metallic, adhesive, anodic, glass frit, hydrophilic and surface activated bonding (SAB)
Pre-bond surface preparation including lithography, plasma activation, and wafer cleaning processes
Integration of bonding processes into microfabrication flows in cleanroom environment
Characterization of bonded interfaces using bond metrolo...
        

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