Senior Wire Bond Equipment Engineer

A global leader in opto semiconductors in Penang, Malaysia is searching for a skilled Engineer to maintain and optimize wire bonding equipment. The ideal candidate will have over 5 years of experience in semiconductor assembly, proficiency in wire bonder platforms, and strong analytical skills. Responsibilities include maintenance, process optimization, and cross-functional collaboration. A Bachelor’s or Master’s degree in Engineering is required. The company offers an opportunity to contribute to innovative technologies and improvements in quality and efficiency.
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