Silicon Packaging Design Engineer

Intel Corporation · seberang perai, penang, Malaysia

Location
seberang perai
Job Type
Full-time
Posted
July 05, 2026

Job Description

## Silicon Packaging Design EngineerApplylocations: Malaysia, Penang: Malaysia, Kulimtime type: Full timeposted on: Posted Todayjob requisition id: JR # **Job Details:**## Job Description:As a Silicon Packaging Design Engineer, you will play a crucial role in driving the end-to-end development of innovative substrate designs. Your expertise will directly impact the performance, cost, and manufacturability of our products, helping Intel maintain its leadership in the semiconductor industry. Working collaboratively with cross-functional teams, you will have the opportunity to optimize silicon-package-board interfaces and contribute to groundbreaking advancements in technology. **Key Responsibilities** include but not be limited to:* Drive the entire substrate design process, from design through tapeout, with a focus on performance, manufacturability, and cost optimization.* Implement the physical layout and routing of package designs using design tools and methodologies and ...

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